Keynotes

Mark M. Tehranipoor

Secure SoC Development Lifecycle: Challenges and Solutions

Speaker: Mark M. Tehranipoor, Ph.D.
Chair Professor and the Chair of the Department of Electrical and Computer Engineering (ECE)
University of Florida


Much of the security concerns during the design of modern system on chips (SoCs) or system-in-package (SiPs) have to do with design mistakes, lack of understanding of security vulnerabilities and the many attack surfaces and vectors that exist. This presentation will discuss challenges to securing silicon development lifecycle, makes a case for automation to lower the development cost, offers solutions to engineers and practitioners, and present research challenges and opportunities for academics.

Mauro Pipponzi

State of the Art of Functional Safety in 2023

Speaker: Mauro Pipponzi
Senior Principal Architect
SiFive


In 2019 the second edition of the ISO26262 standard for functional safety for vehicles has been released, which included the new part 11 specifically dedicated to interpretation of the standard to semiconductors. Using a RISC V processor as an example we will review how the approach to functional safety has evolved in these past years, the level of analysis, the solutions and the challenges, touching random failure, systematic failure, design environment, relationships to related fields, such as test and reliability.

Pierre Maillard

Radiation Effects in FPGA and SoCs

Speaker: Pierre Maillard, Ph.D.
AMD


This keynote talk covers Radiation Effects in Field Programmable Gate Arrays (FPGAs) and Systems on Chips (SoCs). The ability to implement complex designs and evolving algorithms in reconfigurable devices makes FPGAs attractive for many Terrestrial and Space applications, compared to fixed function Application Specific Integrated Circuits (ASICs). This talk will address the basics of SRAM and non-volatile-based FPGA architecture and their evolution to modern/complex SoCs and Adaptive Compute Acceleration Platform (ACAP) devices. Then we will discuss Single Event Effects (SEE) and Total Ionizing Dose (TID) mechanisms, errors classification, mitigation, test methodologies, and representative results. The final section will focus on challenges and potential paths to address requirements for next-gen Terrestrial (telecom, automotive, data centers, avionics, etc.), defense, and space markets.